Alumina Ceramic AMB Copper-clad Substrate

Alumina Ceramic AMB Copper-clad Substrate: The Cost-Effective Power Electronics Solution Product Overview Puwei's Alumina Ceramic AMB Copper-clad Substrate is engineered to deliver the optimal balance of performance, reliability, and cost for mainstream power electronics. Utilizing high-purity Aluminum Oxide (Al₂O₃) bonded with oxygen-free copper via the Active Metal Brazing (AMB) process, it provides a robust and thermally efficient platform. This substrate is the industry-proven choice for a wide range of Electronic Packaging and Microelectronics Packaging applications where economic viability is as critical as technical performance. High-quality Alumina AMB substrate, offering excellent mechanical strength and reliable electrical isolation. Key Advantages for B2B Buyers Unbeatable Cost-Performance Ratio: Achieve reliable thermal management (20-30 W/m·K) and electrical insulation at a fraction of the cost of premium materials like AlN, perfect for high-volume Power Devices. Ex…